Recently, Wayne Meshejian got in touch with Longwood University’s first physics graduate, Lisa Hanmer Perdieu. Lisa is Principle Engineer at the National Nuclear Security Administration’s Kansas City Plant, where she has worked since 1989.
Lisa received a BS degree in Physics, and Masters degree in Supervision from Longwood University. She has worked in the field of Thick-Film Hybrid Microelectronics for 28 years including 5 years with The General Electric Company (defense weapons), 4 years with Honeywell in Newport News, VA (automotive sensors) and 19 years with Honeywell in Kansas City (nuclear weapons). Lisa is currently involved in the development of high value multilayer film capacitors, in addition to providing the day-to-day engineering support necessary for the production of advanced radar development thick-film networks.
Lisa is well versed in designing complex thick-film hybrid microcircuits. Her technical expertise lies in the areas of film printing, microcircuit materials, and microcircuit layouts. Lisa is a certified Six Sigma Black Belt, and she has recently received her DFSS (Design for Six Sigma) Certification. She is familiar with such six sigma tools as Product Mapping, Failure Modes and Effects Analysis, QFD+C, Process Capability Analysis, Regression Analysis, Factorial DOE’s, and Data Analysis Using Power Tools.
Lisa’s contributions in the area of small, high-density microelectronic devices have been significant. She developed the layout design and technical process for an innovative hydrogen sensor concept using a new thick-film palladium, and she published Characterization of Palladium Thick Film for Environmental Sensors, KCP-613-6128. Lisa holds U.S. Patent, No. 6,120,835, Process for Manufacture of Thick Film Hydrogen Sensors.
She successfully coordinated a three-company partnership (Carborundum, Ferro Corporation, and Honeywell, FM&T) to develop a thick-film capability for aluminum nitride. The project resulted in the ability to manufacture high-power microcircuits with efficient thermal properties at FM&T, and she published Thick Film Fabrication of Aluminum Nitride Microcircuits, KCP-613-5283.
Lisa was the Project Leader of the FM&T/Sandia National Laboratory New Mexico team assigned to investigate the mechanical integrity of alumina substrates following a diamond scribe short removal procedure. Lisa gave a technical presentation on the subject to the International Microelectronics and Packaging Society, and she published The Effect of Diamond Scribe Short Removal on the Mechanical Integrity of Alumina Substrates, KCP-613-5934.
Lisa was presented an award by The International Society for Hybrid Microelectronics for “Best Paper of Session” for her publication, The Importance of Substrate Penetration During Resistor Laser Trimming. She wrote this paper following a failure analysis using six sigma tools on a custom resistor network that exhibited negative drift under a long-term powered, thermally stressed environment.